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Electronic Component Seal
Silicone Ink
Embedment
Heat Curing
Viscosity
Liquid Silicone
Overview, this product is a one-component, neutral silicone adhesive, belongs to the dealcohol system, in the role of water vapor in the air curing, curing into a certain toughness, strength of elastic rubber, high and low temperature resistance, it keeps elasticity and stability in-55 ~ 180 °C for a long time, and has excellent aging resistance and weather resistance. Due to the alcohol released during the curing process, it has no corrosion to copper and other materials, and no irritating gas released, it belongs to environmental protection products
Electronic potting silica gel
| THR-1271D | THR-1271E | THR-1271F | THR-1271M | THR-1271R | |||
| Project | index | ||||||
| Before cuing | Appearance | Translucent paste | Transparent flowing | White | White paste | Red paste | |
| Extruded velocity(g/3s) | 10-30 | ≥60 | ≥10 | ≥30 | ≥30 | ||
| Surface dry time(min)(min) | 2-10 | 2-15 | 2-20 | 5-15 | 5-15 | ||
| After curing time | Hardness (Shore A) | 14-18 | 8-15 | 20-30 | 25-35 | 20-30 | |
| Tensile stength(MPa) | ≥0.6 | ≥0.5 | ≥1.0 | ≥1.5 | ≥1.5 | ||
| elongation(%) | ≥300 | ≥250 | ≥200 | ≥400 | ≥500 | ||
| Tear strength(kN/m) | ≥3.5 | ≥1.5 | ≥3.0 | ≥8.0 | ≥8.0 | ||
| idensity(g/cm3) | 1.05±0.05 | 1.05±0.05 | 1.4±0.5 | 1.35±0.05 | 1.35±0.05 | ||
| Heat conductivity (W/mk) | - | - | 0.45 | - | - | ||
Properties under the action of Water Vapor in the air, the room temperature curing system of debonding cured into elastic rubber with certain toughness has excellent adhesion to most substrates, application field for various types of electronic components of bonding and sealing, use method 1. Clean the surface: to be glued or coated surface clean, remove rust, dust and oil, etc. . 2. SIZING: extrude the product to the cleaned surface, make it evenly distributed, and fix it by the adhesive surface. 3. Curing: The glued part is exposed to air to cure it. This product is cured from the outside to the inside of the curing process, 24 hours (25 °C, 50% relative humidity) curing depth of 2-4 mm. If the temperature is low, humidity small curing time will be extended.
It can be applied to PC (poly carbon), PP, ABS, PNC and other materials and metal surfaces. It has excellent adhesion performance and fully meets the requirements of European ROHS directive. The electronic potting adhesive is resistant to high and low temperature (- 50c-2500), water, oxygen and weather aging. It can keep its elasticity at low temperature (- 50). It also has the properties of corrosion resistance and quenching, and has strong adhesion; It has a strong fixation effect on Qingguang panel, solar cell and electronic components. It is used as the sealing material of electronic and electrical components. It has the nature of anti shock and weather resistance and is used as the sealing, bonding and coating materials of electronic components. It also has the functions of moisture-proof, insulation, shockproof and natural resistance. Backlight, high voltage module, conversion line HD lamp module power supply, automobile power supply network transformer, communication element, household electricity, solar cell, solar cell transformer and electronic element can be well responded to
Operation method of electronic sealer:
1. Weigh the weight ratio of component A and component B: measure correctly according to the correct mix proportion (weight ratio). If there is a large error in the measurement of mix proportion, the product characteristics will not be displayed well
2. Mix semi-uniform silica gel and curing agent: mix component A and component B semi uniformly. When mixing AB glue, pour the part with less proportion into the part with more proportion for mixing. When mixing the resistance, it should be smooth and not too decisive. Hold for about 3 minutes. Mix the bottom, wall and other parts of the container evenly. If not, the curing will be incomplete. The container must be semi glue
3. Vacuumize and discharge bubbles: move to the vacuum box quickly after fully mixing. The bubbles involved in the material mixing will make the liquid level rise, and the liquid level will fall again after the bubbles break. The vacuum degree, the viscosity of the glue and the requirements of the product are fixed (generally 2-4 minutes for defoaming). If there is no vacuum machine, the glue can be placed for 5-20 minutes in the clockwise direction for 2-3 minutes
4. Pour in the sealant and wait for curing: inject the necessary amount of sealant, and at the same time pay attention not to get involved in bubbles. After flowing into the bottom along the inner wall of the shell, let the glue level rise slowly and solidify at the set temperature
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